A revolution in ultra-compact device design, Intel NUC packages a fully scalable computing solution in the smallest possible form factor. Today, FanlessTech leaked the complete roadmap of Intel NUC for 2015 and beyond. It revealed several new information such the Broadwell NUC will be available in Q1 2015. More Highlights: ✓ Broadwell NUC officially moved to Q1 2015 ✓ i5 version aimed at serious gaming (SteamBox anyone?) ✓ i5 and i3 versions aimed at content creation (full desktop replacement?) ✓ M.2 storage and 2.5″ bay, or M.2 storage only for super slim chassis ✓ Kisses external USB 2.0 ports goodbye ✓ Bids adieu to mSATA SSD ✓ Entry-level Braswell (Bay Trail’s successor) version available in Q2 ✓ Braswell SKU to feature TOSLINK jack and SDXC UHS-I card slot (nice) ✓ All compatible with 3rd party fanless chassis Find more information from the link below. Source: FanlessTech   ...

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Intel today revealed more information on its microarchitecture of the Intel Core M processor, the first product to be manufactured using 14nm. Intel’s new microarchitecture and manufacturing process will enable a wave of innovation in new form factors, experiences and systems that are thinner and run silent and cool. Intel even showed off a prototype of just 7.2mm thickness. Intel architects and chip designers have achieved greater than two times reduction in the thermal design point when compared to a previous generation of processor while providing similar performance and improved battery life. The new microarchitecture was optimized to take advantage of the new capabilities of the 14nm manufacturing process. Intel has delivered the world’s first 14nm technology in volume production. It uses second-generation Tri-gate (FinFET) transistors with industry-leading performance, power, density and cost per transistor. Intel’s 14nm technology will be used to manufacture a wide range of high-performance to low-power products ...

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Intel announced the next generation chips based on Broadwell 14nm architecture last year. However, the product launch got delayed and it was expected to be available in the personal computers sold during the holiday season. Seems like there will be more delay as CNet today reported that broader OEM availability of the next gen Intel mobile CPUs are expected only in 2015. “We expect the initial Broadwell-based devices, including fanless 2-in-1s built on the Core M processor, will be on shelves by the end of this year with more products and broader OEM availability in 2015,” At COMPUTEX, Intel revealed more information about their next gen Core product codenamed Broadwell. To demonstrate it, Intel revealed the world’s first 14nm fanless mobile PC reference design from Intel is a 12.5 inch screen that is 7.2mm thin with keyboard detached and weighs 670 grams. The majority of designs based on this new ...

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At COMPUTEX, Intel revealed more information about their next gen Core product codenamed Broadwell. It will be the first 14-nanometer chip from Intel. To demonstrate it, Intel revealed the world’s first 14nm fanless mobile PC reference design from Intel is a 12.5 inch screen that is 7.2mm thin with keyboard detached and weighs 670 grams. It is based on the first of Intel’s next-generation 14nm Broadwell processors, purpose-built for 2 in 1s and will be in market later this year. Called the Intel® Core™ M processor, it will deliver the most energy efficient Core processor in the company’s history. The majority of designs based on this new chip are expected to be fanless and deliver both a lightning-fast tablet and a razor-thin laptop. Intel also announced 4th generation Intel® Core™ i7 and i5 processor “K” SKU, the first from Intel to deliver four cores at up to 4 GHz base ...

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Intel’s new CEO Brian Krzanich yesterday kicked off Intel Developer Forum by revealing some new details about the upcoming Intel chips. He showed off a laptop running the upcoming Broadwell chip architecture on stage during a keynote at the Intel Developer Forum (IDF) today. This broadwell chips will offer upto 30 percent improvements in PC power efficiency when it launches by the end of next year. Also this chip will enable fanless powerful Windows based devices. Intel is also launching “Bay Trail,” Intel’s first 22nm system-on-a-chip (SoC) for mobile devices. “Bay Trail” is based on the company’s new low-power, high-performance Silvermont microarchitecture, which will power a range of innovative Android* and Windows* designs, most notably tablets and 2 in 1 devices. Read full press release below. Press Release: INTEL DEVELOPER FORUM, San Francisco, Sept. 10, 2013 – From datacenters to ultra-mobile devices such as tablets, phones and wearables, computing segments ...

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Intel recently previewed its upcoming energy-efficient versions of the Y-series Core processors that will consume as little as 4.5W power. These chips are expected to power fanless tablets and Intel so far has not revealed any upcoming tablet designs that will be using this chip. I expect Microsoft to refresh its Surface Pro device with this new chips for better battery performance. The 4.5W chips will have same 11.5W thermal design power rating as their 6W counter parts. There are obvious implications for the next-generation of Microsoft’s Surface Pro. It’s unclear whether Microsoft will wait until Broadwell to reduce the thickness of Surface Pro, or if it’ll go with a Y-series Haswell ULX part this year and release something that’s much thinner immediately. The challenges Microsoft would face there are similar to those Apple faced with the 2013 MacBook Air, namely Microsoft would have to be accepting of a CPU ...

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